ipb065n06l g ipp065n06l g opti mos ? power-transistor features ? for fast switching converters and sync. rectification ? n-channel enhancement - logic level ? 175 c operating temperature ? avalanche rated ? pb-free lead plating, rohs compliant maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25 c 1) 80 a t c =100 c 80 pulsed drain current i d,pulse t c =25 c 2) 320 avalanche energy, single pulse e as i d =80 a, r gs =25 ? 530 mj reverse diode d v /d t d v /d t i d =80 a, v ds =48 v, d i /d t =200 a/s, t j,max =175 c 6 kv/s gate source voltage v gs 20 v power dissipation p tot t c =25 c 250 w operating and storage temperature t j , t stg -55 ... 175 c iec climatic category; din iec 68-1 55/175/56 value 2) see figure 3 1) current is limited by bondwire; with an r thjc =0.6 k/w the chip is able to carry 125 a. v ds 60 v r ds(on),max 6.5 m ? i d 80 a product summary type package marking ipb063n06l g p-to263-3-2 063n06l ipp063n06l g pp-to220-3-1 063n06l type ipb065n06l g ipp065n06l g package pg-to263-3-2 pg-to220-3-1 marking 065n06l 065n06l rev. 1.1 page 1 2006-05-05
ipb065n06l g ipp065n06l g parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - case r thjc - - 0.6 k/w smd version, device on pcb r thja minimal footprint - - 62 6 cm 2 cooling area 3) --40 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0 v, i d =1 ma 60 - - v gate threshold voltage v gs(th) v ds = v gs , i d =180 a 1.2 1.6 2 zero gate voltage drain current i dss v ds =60 v, v gs =0 v, t j =25 c - 0.01 1 a v ds =60 v, v gs =0 v, t j =125 c - 1 100 gate-source leakage current i gss v gs =20 v, v ds =60 v - 1 100 na drain-source on-state resistance r ds(on) v gs =10 v, i d =80 a - 5.4 6.5 m ? v gs =4.5 v, i d =53 a - 6.5 8.4 v gs =10 v, i d =80 a, smd version 5.1 6.2 v gs =4.5 v, i d =53 a, smd version 6.2 8.1 gate resistance r g - 2.2 - ? transconductance g fs | v ds |>2| i d | r ds(on)max , i d =80 a 63 126 - s 3) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. values rev. 1.1 page 2 2006-05-05
ipb065n06l g ipp065n06l g parameter symbol conditions unit min. typ. max. d y namic characteristics input capacitance c iss - 3800 5100 pf output capacitance c oss - 890 1200 reverse transfer capacitance c rss - 220 330 turn-on delay time t d(on) -1117ns rise time t r -2132 turn-off delay time t d(off) -6090 fall time t f -2030 gate char g e characteristics 4) gate to source charge q gs -1318nc gate charge at threshold q g(th) -68 gate to drain charge q gd -4263 switching charge q sw -4972 gate charge total q g - 118 157 gate plateau voltage v plateau - 3.5 - v output charge q oss v dd =30 v, v gs =0 v -3547 reverse diode diode continous forward current i s - - 80 a diode pulse current i s,pulse - - 320 diode forward voltage v sd v gs =0 v, i f =80 a, t j =25 c - 0.95 1.3 v reverse recovery time t rr -6076ns reverse recovery charge q rr - 92 115 nc 4) see figure 16 for gate charge parameter definition v r =30 v, i f = i s , d i f /d t =100 a/s t c =25 c values v gs =0 v, v ds =30 v, f =1 mhz v dd =30 v, v gs =4.5v, i d =80 a, r g =1.6 ? v dd =30 v, i d =80 a, v gs =0 to 10 v rev. 1.1 page 3 2006-05-05
ipb065n06l g ipp065n06l g 1 power dissipation 2 drain current p tot =f( t c ) i d =f( t c ); v gs 10 v 3 safe operating area 4 max. transient thermal impedance i d =f( v ds ); t c =25 c; d =0 z thjc =f( t p ) parameter: t p parameter: d = t p / t 1 s 10 s 100 s 1 ms 10 ms dc 10 2 10 1 10 0 10 -1 10 3 10 2 10 1 10 0 10 -1 v ds [v] i d [a] limited by on-state resistance single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 0 10 -1 10 -2 t p [s] z thjc [k/w] 0 50 100 150 200 250 300 0 50 100 150 200 t c [c] p tot [w] 0 25 50 75 100 0 50 100 150 200 t c [c] i d [a] rev. 1.1 page 4 2006-05-05
ipb065n06l g ipp065n06l g 5 typ. output characteristics 6 typ. drain-source on resistance i d =f( v ds ); t j =25 c r ds(on) =f( i d ); t j =25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. forward transconductance i d =f( v gs ); | v ds |>2| i d | r ds(on)max g fs =f( i d ); t j =25 c parameter: t j 3 v 3.5 v 4 v 4.5 v 5 v 5.5 v 10 v 0 4 8 12 16 20 0 50 100 150 200 i d [a] r ds(on) [m ? ] 25 c 175 c 0 30 60 90 120 150 180 012345 v gs [v] i d [a] 0 30 60 90 120 150 0 20406080 i d [a] g fs [s] 3 v 3.5 v 4 v 4.5 v 5.5 v 5.5 v 10 v 0 0 50 100 150 200 250 300 012345 v ds [v] i d [a] rev. 1.1 page 5 2006-05-05
ipb065n06l g ipp065n06l g 9 drain-source on-state resistance 10 typ. gate threshold voltage r ds(on) =f( t j ); i d =80 a; v gs =10 v v gs(th) =f( t j ); v gs = v ds parameter: i d 11 typ. capacitances 12 forward characteristics of reverse diode c =f( v ds ); v gs =0 v; f =1 mhz i f =f( v sd ) parameter: t j typ 98 % 0 4 8 12 16 -60 -20 20 60 100 140 180 t j [c] r ds(on) [m ? ] 180 a 1800 a 0 0.5 1 1.5 2 2.5 -60 -20 20 60 100 140 180 t j [c] v gs(th) [v] ciss coss crss 10 4 10 3 10 2 0 1020304050 v ds [v] c [pf] 25 c 175 c 25c 98% 175c 98% 10 3 10 2 10 1 10 0 10 -1 0 0.5 1 1.5 2 v sd [v] i f [a] rev. 1.1 page 6 2006-05-05
ipb065n06l g ipp065n06l g 13 avalanche characteristics 14 typ. gate charge i as =f( t av ); r gs =25 ? v gs =f( q gate ); i d =80 a pulsed parameter: t j(start) parameter: v dd 15 drain-source breakdown voltage 16 gate charge waveforms v br(dss) =f( t j ); i d =1 ma 12v 30 v 48 v 0 2 4 6 8 10 12 0 40 80 120 q gate [nc] v gs [v] 50 54 58 62 66 70 74 -60 -20 20 60 100 140 180 t j [c] v br(dss) [v] v gs q gate v gs(th) q g(th) q gs q gd q sw q g 25 c 100 c 150 c 10 3 10 2 10 1 10 0 10 2 10 1 10 0 t av [s] i av [a] rev. 1.1 page 7 2006-05-05
ipb065n06l g ipp065n06l g pg-to220-3: outline rev. 1.1 page 8 2006-05-05
ipb065n06l g ipp065n06l g pg-to-263 (d2-pak) rev. 1.1 page 9 2006-05-05
ipb065n06l g ipp065n06l g published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2006. a ll rights reserved. a ttention please! the information given in this data sheet shall in no event be r egarded as a guarantee of conditions or characteristics (beschaffenheitsgarantie). with respect to an y examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby non-infringement of intellectual property rights of any third p arty. information for further information on technology, delivery terms and condi tions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies offi ce. infineon technologies components may only be used in life-suppo rt devices or systems with the express written approval of infineon technologies, if a failure of such compone nts can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human bo dy, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to as sume that the health of the user or other persons may be endangered. rev. 1.1 page 10 2006-05-05
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